Recent market discussions surrounding Taiwan Semiconductor Manufacturing's (TSM) advanced CoPoS packaging technology have intensified significantly, leading to a phase of unusually speculative activity among Taiwanese tech stocks.
According to multiple key figures in the supply chain interviewed by Taiwanese tech media, the market's interpretation of the CoPoS technology roadmap contains a significant misunderstanding, particularly regarding whether a glass substrate is a necessary component for the first-generation product.
The interviewed individuals expressed strong dissatisfaction with the widespread circulation of inaccurate rumors. The market generally views glass substrates as an indispensable core material for CoPoS, but the first generation of CoPoS is very likely not to utilize a glass substrate in its technical implementation.
Furthermore, Taiwan Semiconductor Manufacturing has never considered using a glass interposer. CoPoS is expected to enter mass production in the first half of 2029.
Companies including Samsung Electro-Mechanics (SEMCO) under the Samsung Group, Japan's Toppan, and other substrate manufacturers from Japan and South Korea have all entered the competition to develop glass-core substrates and have recently begun submitting engineering samples to Taiwan Semiconductor Manufacturing.
A glass interposer is located between the chip and the package substrate, responsible for high-speed interconnects between components like GPUs and HBM. The glass-core substrate sits below the interposer, serving as the foundational carrier for the entire package, providing mechanical support and connection to the PCB.
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