$Taiwan Semiconductor Manufact

$Taiwan Semiconductor Manufacturing(TSM)$ It feels like the next big leap in AI chips is quietly being prepared.

Word is that next-gen CoPoS packaging could hit mass production in the second half of 2028, targeting ultra-large AI chips beyond the current 9.5x reticle size.

Key points I'm watching:

Built for massive AI accelerators

Advanced packaging becoming just as critical as the chips themselves

Glass and ABF substrates might coexist instead of one replacing the other

NVDA's Feynman could be an early adopter, which would make this rollout more interesting.

It feels like everyone is still only talking GPUs, but the real game is quietly shifting to packaging, thermals, and substrate tech.

I'm watching this closely. These are the kinds of details that usually catch the market off guard.

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