异动解读05-27
建滔积层板今日盘中大涨7.84%，引起了市场的广泛关注。
消息面上，摩根士丹利近期对英伟达新一代Rubin机架进行拆解分析，发现其VR200 NVL72机柜中的PCB（印刷电路板）价值量较前代产品大幅上涨233%，这直接提振了PCB产业链相关公司的市场预期。作为PCB关键原材料覆铜板（CCL）的主要供应商，建滔积层板显著受益于此技术升级带来的需求增长。
此外，覆铜板行业整体供需格局持续紧张，韩国PCB厂商因担忧供应链中断，已向中国CCL厂商下达了超常规的预购订单，导致部分高端产品交货周期延长至6周以上。公司层面，建滔积层板已于4月内两次宣布全系覆铜板产品涨价10%，累计涨幅超过40%，充分展现了其强大的成本转嫁能力和在行业内的定价权。同行业公司股价亦同步走强，板块呈现普涨格局。
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