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异动解读|建滔积层板盘中上涨4.7%,英伟达Rubin架构PCB价值量大涨233%提振板块

行情直击05-27

5月27日,建滔积层板盘中上涨4.7%,报58.5港元/股,成交额3.12亿港元,续创新高。

消息面上,摩根士丹利近期对英伟达新一代Rubin机架进行BOM拆解,VR200 NVL72机柜中PCB价值量较GB300大涨233%,从3.51万美元跃升至11.67万美元,成为非内存品类涨幅第一。此外,覆铜板行业供需紧张格局延续,韩国PCB厂商因断供担忧向中国CCL厂商下达超常规预购订单,部分高端产品交货周期延长至6周以上。公司此前已于4月内两次宣布全系覆铜板涨价10%,累计涨幅超40%,彰显较强成本转嫁能力。同行业建滔集团涨3.11%、鸿腾精密涨5.31%,板块整体走强。

(以上内容均基于市场公开消息,由程序或算法智能生成,仅作为股价异动提醒,不作为投资建议或交易依据。)

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