$Taiwan Semiconductor Manufacturing(TSM)$
The company is expected to reach roughly 180,000 3nm wafers per month early in Q4, while $NVIDIA(NVDA)$ , $Advanced Micro Devices(AMD)$ , and $Broadcom(AVGO)$ continue locking in as much capacity as possible. That doesn't happen unless customers see sustained AI demand ahead.
What's even more interesting is that 2nm demand is accelerating fast, with monthly output projected to approach 100,000 wafers by year-end. The real battle in AI isn't just about who designs the best chips anymore. It's about who can secure enough cutting-edge manufacturing capacity before everyone else.
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