$Taiwan Semiconductor Manufacturing(TSM)$ TSMC is moving full speed ahead to increase capacity to meet assessed demand, and stepping up CapEx investment to support customers' future growth. The company is expanding at an unprecedented pace with nearly 20 fabs worldwide in progress. They are building 13 leading-edge and advanced packaging fabs in Taiwan over the next several years, plus another five to six overseas. The N2 node has already entered high-volume manufacturing in Q4 2025 with good yield. N2 is ramping successfully in multiple phases at both Hsinchu and Kaohsiung. They expect N2 family annual capacity to more than double in 2027, supported by strong demand from smartphone and HPC AI applications. They are also leveraging manufacturing strength to generate more N2 wafer output and further increase capacity support to customers.
This is just part of the call. The transcript is easy to find online and save.
Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.
