台积电3nm芯片提前一年正式量产,英特尔抢跑苹果首家采用
华尔街见闻2021-08-10
此次英特尔向台积电下的订单包含带有集成显卡的三种服务器CPU,均为该公司的核心产品,首批数量约为4000片,明年7月正式量产。
据中国台湾经济日报,英特尔将成为第一家采用台积电3nm芯片制程的半导体公司。该制程将用于生产服务器芯片,预计明年二季度开始在台积电18b厂投片,7月份正式量产,实际量产时间较原计划提前一年。
长期以来,台积电最先进的芯片制程通常以苹果作为第一个客户,主要生产当年最新款iPhone的A系列处理器。
英特尔与台积电的本次合作,意味着该公司肯定台积电领先于三星的优势地位。按照台积电此前的说法,3nm工艺性较5nm能提升10~15%,功耗降低25~30%。
中国台湾经济日报援引台积电供应商称,此次英特尔向台积电下的订单包含带有集成显卡的三种服务器CPU,均为该公司的核心产品,首批数量约为4000片。
近日,台积电董事长刘德音答股东问“如何看待英特尔涉足晶圆代工时强调“英特尔是台积电的客户,我们相信英特尔会采用台积电的最先进技术”。言下之意似乎对英特尔与其合作3纳米芯片生产早有定论。
截至昨日美股收盘,英特尔股价报54.05美元,涨0.24%;台积电股价报118.22美元,涨0.01%。


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