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05-26
MU already price in 2027
Storage capacity simply can't keep up! Micron warns: Stock shortages will continue until after 2026
美光在摩根大通科技峰会上表示,受AI强劲需求驱动,HBM、DRAM及NAND的供应紧张局面预计将持续至2026年以后。供应扩张面临性能提升收窄、晶粒尺寸增大及EUV爬坡制约等结构性瓶颈,即便厂商全力推进产能建设,短期内仍难以填补AI带来的供给缺口。
Storage capacity simply can't keep up! Micron warns: Stock shortages will continue until after 2026
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05-18
No Sense! Just help someone to get lower price to buy in
Salesforce reinstated with an Underperform at BofA amid structural reset
As previously reported, BofA analyst Tal Liani reinstated coverage of Salesforce (CRM) with an Underperform rating and $160 price target Salesforce...
Salesforce reinstated with an Underperform at BofA amid structural reset
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Micron warns: Stock shortages will continue until after 2026","url":"https://stock-news.laohu8.com/highlight/detail?id=2638553272","media":"华尔街见闻","summary":"美光在摩根大通科技峰会上表示,受AI强劲需求驱动,HBM、DRAM及NAND的供应紧张局面预计将持续至2026年以后。供应扩张面临性能提升收窄、晶粒尺寸增大及EUV爬坡制约等结构性瓶颈,即便厂商全力推进产能建设,短期内仍难以填补AI带来的供给缺口。","content":"<p><html><head></head><body><p style=\"text-align: left;\"><span style=\"color: rgb(34, 34, 34); background-color: rgb(255, 255, 255);\">At the JPMorgan Technology Summit, Micron stated that the supply shortage of HBM, DRAM, and NAND is expected to continue beyond 2026, driven by strong demand for AI. Supply expansion faces structural bottlenecks such as narrowing performance improvements, increasing grain size, and constraints on EUV ramp-up. Even if manufacturers make every effort to build production capacity, it will still be difficult to fill the supply gap brought about by AI in the short term.</span></p><p><p style=\"text-align: left;\">The AI computing power arms race is pushing the global memory chip market into a multi-year supply shortage.</p><p><p style=\"text-align: left;\"><a href=\"https://laohu8.com/S/MU\">Micron Technology</a>(Micron Technology) Management<a href=\"https://laohu8.com/S/JPM\">JPMorgan Chase</a>It was stated at the annual technology summit that<strong>The supply shortage of HBM, DRAM, and NAND memory chips is expected to extend far beyond 2026, with core drivers...<a href=\"https://laohu8.com/S/600405\">power source</a>There is strong demand for high-performance storage from artificial intelligence applications, while the supply side is constrained by technological bottlenecks that make it difficult to expand production rapidly.</strong></p><p><p style=\"text-align: left;\">JPMorgan Chase cited the above views in a subsequent investment report, stating that after listening to Micron's management statement, the bank had greater confidence in the multi-year bull market logic of the AI storage market. The supply-demand gap is unlikely to reverse in the short term, which sends a clear signal to investors in the storage industry.</p><p><h2 style=\"text-align: left;\">Supply expansion faces structural constraints</h2><p style=\"text-align: left;\">According to a JPMorgan report,<strong>Micron points out that the tight supply in the storage market has structural characteristics and is not simply a production cycle issue.</strong></p><p><p style=\"text-align: left;\">Specifically, the limited supply growth mainly comes from two aspects: On the one hand, the performance improvement of the new generation of memory chips is gradually narrowing, which means that the space for expanding effective supply solely through technological iteration has been significantly compressed.</p><p><p style=\"text-align: left;\">On the other hand, the grain size of the new generation of HBM chips continues to increase, leading to a decrease in the number of chips produced per wafer and further weakening supply elasticity. In addition, while the introduction of extreme ultraviolet (EUV) lithography technology helps improve the manufacturing accuracy of advanced process DRAM, it also creates new constraints in terms of capacity ramp-up speed and cost.</p><p><p style=\"text-align: left;\">With the above factors combined,<strong>Even if storage manufacturers actively expand production, it will still be difficult to quickly fill the supply gap caused by AI demand in the short term.</strong></p><p><h2 style=\"text-align: left;\">HBM4 mass production accelerates, with 1-gamma node becoming the highest production node in history.</h2><p style=\"text-align: left;\">Micron disclosed several key pieces of information regarding product progress.</p><p><p style=\"text-align: left;\">Micron's management stated that, driven by strong demand for AI applications,<strong>The company's 1-gamma process node is expected to become its highest-yielding DRAM node per wafer ever.</strong>。 HBM memory chips are made by vertically stacking and packaging multiple DRAM modules and are widely used in AI GPUs. Micron is continuously integrating EUV lithography processes into the mass production process of 1-gamma nodes.</p><p><p style=\"text-align: left;\">In terms of the pace of HBM product iteration,<strong>Micron revealed that the mass production ramp-up speed of the HBM4 is twice that of the HBM3. The mass production ramp-up of the next-generation HBM4E product is expected to begin in 2027.</strong>The first batch of samples will use DRAM modules manufactured based on 1-gamma nodes.</p><p><h2 style=\"text-align: left;\">Expanding demand for AI inference is driving up SSD market share.</h2><p style=\"text-align: left;\">In addition to HBM and DRAM, Micron also pointed out that the evolution of AI workloads is creating new growth opportunities for its solid-state drive (SSD) business.</p><p><p style=\"text-align: left;\">Micron's management stated that<strong>The continued expansion of the AI context window and the rapid growth of inference workloads have driven the demand for large-capacity, high-performance storage, enabling the company to increase its share in the SSD market.</strong></p><p><p style=\"text-align: left;\">It is worth noting that Micron emphasizes that its strategy is not to provide standardized off-the-shelf products, but to collaborate deeply with customers to customize storage solutions for specific application scenarios. This model helps to consolidate customer loyalty and increase product premium margins.</p><p></body></html></p>","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>Storage capacity simply can't keep up! Micron warns: Stock shortages will continue until after 2026</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 12.5px; color: #7E829C; margin: 0;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nStorage capacity simply can't keep up! Micron warns: Stock shortages will continue until after 2026\n</h2>\n<h4 class=\"meta\">\n<a class=\"head\" href=\"https://laohu8.com/wemedia/1084101182\">\n\n<div class=\"h-thumb\" style=\"background-image:url(https://static.tigerbbs.com/66809d1f5c2e43e2bdf15820c6d6897e);background-size:cover;\"></div>\n\n<div class=\"h-content\">\n<p class=\"h-name\">华尔街见闻 </p>\n<p class=\"h-time smaller\">2026-05-25 21:50</p>\n</div>\n</a>\n</h4>\n</header>\n<article>\n<p><html><head></head><body><p style=\"text-align: left;\"><span style=\"color: rgb(34, 34, 34); background-color: rgb(255, 255, 255);\">At the JPMorgan Technology Summit, Micron stated that the supply shortage of HBM, DRAM, and NAND is expected to continue beyond 2026, driven by strong demand for AI. Supply expansion faces structural bottlenecks such as narrowing performance improvements, increasing grain size, and constraints on EUV ramp-up. Even if manufacturers make every effort to build production capacity, it will still be difficult to fill the supply gap brought about by AI in the short term.</span></p><p><p style=\"text-align: left;\">The AI computing power arms race is pushing the global memory chip market into a multi-year supply shortage.</p><p><p style=\"text-align: left;\"><a href=\"https://laohu8.com/S/MU\">Micron Technology</a>(Micron Technology) Management<a href=\"https://laohu8.com/S/JPM\">JPMorgan Chase</a>It was stated at the annual technology summit that<strong>The supply shortage of HBM, DRAM, and NAND memory chips is expected to extend far beyond 2026, with core drivers...<a href=\"https://laohu8.com/S/600405\">power source</a>There is strong demand for high-performance storage from artificial intelligence applications, while the supply side is constrained by technological bottlenecks that make it difficult to expand production rapidly.</strong></p><p><p style=\"text-align: left;\">JPMorgan Chase cited the above views in a subsequent investment report, stating that after listening to Micron's management statement, the bank had greater confidence in the multi-year bull market logic of the AI storage market. The supply-demand gap is unlikely to reverse in the short term, which sends a clear signal to investors in the storage industry.</p><p><h2 style=\"text-align: left;\">Supply expansion faces structural constraints</h2><p style=\"text-align: left;\">According to a JPMorgan report,<strong>Micron points out that the tight supply in the storage market has structural characteristics and is not simply a production cycle issue.</strong></p><p><p style=\"text-align: left;\">Specifically, the limited supply growth mainly comes from two aspects: On the one hand, the performance improvement of the new generation of memory chips is gradually narrowing, which means that the space for expanding effective supply solely through technological iteration has been significantly compressed.</p><p><p style=\"text-align: left;\">On the other hand, the grain size of the new generation of HBM chips continues to increase, leading to a decrease in the number of chips produced per wafer and further weakening supply elasticity. In addition, while the introduction of extreme ultraviolet (EUV) lithography technology helps improve the manufacturing accuracy of advanced process DRAM, it also creates new constraints in terms of capacity ramp-up speed and cost.</p><p><p style=\"text-align: left;\">With the above factors combined,<strong>Even if storage manufacturers actively expand production, it will still be difficult to quickly fill the supply gap caused by AI demand in the short term.</strong></p><p><h2 style=\"text-align: left;\">HBM4 mass production accelerates, with 1-gamma node becoming the highest production node in history.</h2><p style=\"text-align: left;\">Micron disclosed several key pieces of information regarding product progress.</p><p><p style=\"text-align: left;\">Micron's management stated that, driven by strong demand for AI applications,<strong>The company's 1-gamma process node is expected to become its highest-yielding DRAM node per wafer ever.</strong>。 HBM memory chips are made by vertically stacking and packaging multiple DRAM modules and are widely used in AI GPUs. Micron is continuously integrating EUV lithography processes into the mass production process of 1-gamma nodes.</p><p><p style=\"text-align: left;\">In terms of the pace of HBM product iteration,<strong>Micron revealed that the mass production ramp-up speed of the HBM4 is twice that of the HBM3. The mass production ramp-up of the next-generation HBM4E product is expected to begin in 2027.</strong>The first batch of samples will use DRAM modules manufactured based on 1-gamma nodes.</p><p><h2 style=\"text-align: left;\">Expanding demand for AI inference is driving up SSD market share.</h2><p style=\"text-align: left;\">In addition to HBM and DRAM, Micron also pointed out that the evolution of AI workloads is creating new growth opportunities for its solid-state drive (SSD) business.</p><p><p style=\"text-align: left;\">Micron's management stated that<strong>The continued expansion of the AI context window and the rapid growth of inference workloads have driven the demand for large-capacity, high-performance storage, enabling the company to increase its share in the SSD market.</strong></p><p><p style=\"text-align: left;\">It is worth noting that Micron emphasizes that its strategy is not to provide standardized off-the-shelf products, but to collaborate deeply with customers to customize storage solutions for specific application scenarios. This model helps to consolidate customer loyalty and increase product premium margins.</p><p></body></html></p>\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"https://community-static.tradeup.com/news/01eaf058af436cca2f4a0dfb3f908c1a","relate_stocks":{"MUU":"2倍做多MU ETF-Direxion","GB00BDT5M118.USD":"天利环球扩展Alpha基金A Acc","BK4585":"ETF&股票定投概念","LU0889565833.HKD":"FRANKLIN TECHNOLOGY \"A\" (HKD) ACC","BK4141":"半导体产品","LU2471134879.HKD":"INVESCO GLOBAL EQUITY INCOME ADVANTAGE \"A\" (HKD) INC","LU0154236417.USD":"BGF US FLEXIBLE EQUITY \"A2\" ACC","LU2357627491.SGD":"TRP GLOBAL VALUE EQUITY \"AH\" (SGDHDG) ACC","IE00B7SZLL34.SGD":"Legg Mason ClearBridge - Value A Acc SGD-H","LU0056508442.USD":"贝莱德世界科技基金A2","LU2054465674.USD":"UBS (LUX) KEY SELEC SICAV DIGITAL TRANSFORMATION T \"P\" (USD) ACC","MULL":"2倍做多MU ETF-GraniteShares","BK4533":"AQR资本管理(全球第二大对冲基金)","LU2471134523.USD":"INVESCO GLOBAL EQUITY INCOME ADVANTAGE \"A\" (USD) ACC","IE00B19Z3B42.SGD":"Legg Mason ClearBridge - Value A Acc SGD","LU1316542783.SGD":"Janus Henderson Horizon Global Technology Leaders A2 SGD","LU2211815571.USD":"ALLIANZ POSITIVE CHANGE \"AT\" (USD) ACC","BK4566":"资本集团","BK4575":"芯片概念","LU2458330169.SGD":"FRANKLIN SHARIAH TECHNOLOGY \"A\" (SGD) ACC","LU1852331112.SGD":"Blackrock World Technology Fund A2 SGD-H","LU2471134796.USD":"INVESCO GLOBAL EQUITY INCOME ADVANTAGE \"A\" (USD) INC","LU2286300806.USD":"Allianz Cyber Security AT Acc USD","IE0002270589.USD":"LEGG MASON CLEARBRIDGE VALUE \"A\" (USD) INC","LU0203347892.USD":"SCHRODER ISF QEP GLOBAL ACTIVE VALLUE \"A\" (USD) INC AV","LU2458330243.SGD":"FRANKLIN SHARIAH TECHNOLOGY \"A-H1\" (SGDHDG) ACC","LU2750360641.GBP":"INVESCO GLOBAL EQUITY INCOME ADVANTAGE \"A\" (GBPHDG) INC","LU0109392836.USD":"富兰克林科技股A","LU2250418816.HKD":"BGF WORLD TECHNOLOGY \"A\" (HKD) ACC","LU2750360997.AUD":"INVESCO GLOBAL EQUITY INCOME ADVANTAGE \"A\" (AUDHDG) INC","LU0792757196.USD":"TEMPLETON SHARIAH GLOBAL EQUITY FUND \"A\" (USD) ACC","IE00B5949003.HKD":"JANUS HENDERSON GLOBAL TECHNOLOGY AND INNOVATION \"A\" (HKD) ACC","LU0642271901.SGD":"Janus Henderson Horizon Global Technology Leaders A2 SGD-H","BK4579":"人工智能","BK4588":"碎股","LU0274383776.USD":"MANULIFE GF US SMALL CAP EQUITY \"AA\" (USD) INC","LU0127658192.USD":"EASTSPRING INVESTMENTS GLOBAL TECHNOLOGY \"A\" (USD) ACC","LU2360106780.USD":"BGF WORLD TECHNOLOGY \"A4\" (USD) INC","LU0082616367.USD":"摩根大通美国科技A(dist)","BK4605":"半导体精选","LU0203345920.USD":"SCHRODER ISF QEP GLB ACT. VL \"A\" (USD) ACC","LU2089985449.USD":"MANULIFE GF GLOBAL SEMICONDUCTOR OPPORTUNITIES \"AA\" (USD) ACC","LU1366333091.USD":"FIDELITY GLOBAL FOCUS \"A\" (USD) ACC","LU2048586759.USD":"ALLIANZ SMART ENERGY \"AT\" (USD) ACC","LU0719512351.SGD":"JPMorgan Funds - US Technology A (acc) SGD","IE0009356076.USD":"JANUS HENDERSON GLOBAL TECHNOLOGY AND INNOVATION \"A2\" (USD) ACC","IE00B19Z3581.USD":"Legg Mason ClearBridge - Value A Acc USD","LU1803068979.SGD":"FTIF - Franklin Technology A (acc) SGD-H1","LU2931357623.SGD":"MANULIFE GF GLOBAL SEMICONDUCTOR OPPORTUNITIES \"AA\" (SGDHDG) ACC","BK4553":"喜马拉雅资本持仓","LU0889566641.SGD":"FTSF - Templeton Shariah Global Equity A Acc SGD","MUD":"1倍做空MU ETF-Direxion","MU":"美光科技","LU0157215616.USD":"FIDELITY GLOBAL FOCUS \"A\" INC","LU1914381329.SGD":"Allianz Best Styles Global Equity Cl ET Acc H2-SGD","LU0081259029.USD":"UBS (LUX) EQUITY FUND - TECH OPPORTUNITY \"P\" (USD) ACC","BK4554":"元宇宙及AR概念","BK4532":"文艺复兴科技持仓","LU2543165471.USD":"E FUND (HK) GLOBAL QUALITY GROWTH \"A\" (USD) ACC","LU1323610961.USD":"UBS (LUX) EQUITY SICAV - LONG TERM THEMES (USD) \"P\" (USD) ACC","BK4543":"AI","LU0859254822.USD":"T ROWE PRICE GLOBAL VALUE EQUITY \"A\" (USD) ACC","BK4512":"苹果概念","LU1267930813.SGD":"FRANKLIN TEMPLETON SHARIAH GLOBAL EQUITY \"AS\" (SGD) ACC","BK4527":"明星科技股","LU2471134952.CNY":"INVESCO GLOBAL EQUITY INCOME ADVANTAGE \"A\" (CNYHDG) INC"},"source_url":"https://wallstreetcn.com/articles/3773088","is_english":false,"share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","article_id":"2638553272","content_text":"美光在摩根大通科技峰会上表示,受AI强劲需求驱动,HBM、DRAM及NAND的供应紧张局面预计将持续至2026年以后。供应扩张面临性能提升收窄、晶粒尺寸增大及EUV爬坡制约等结构性瓶颈,即便厂商全力推进产能建设,短期内仍难以填补AI带来的供给缺口。AI算力军备竞赛正将全球存储芯片市场推向多年期的供应紧缺状态。美光科技(Micron Technology)管理层在摩根大通年度科技峰会上表示,HBM、DRAM及NAND存储芯片的供应紧张局面预计将远远超出2026年,核心驱动力源自人工智能应用对高性能存储的强劲需求,而供应端受制于技术瓶颈难以快速扩产。摩根大通在随后发布的投资报告中援引上述观点,并表示该行在听取美光管理层陈述后,对AI存储市场的多年牛市逻辑更具信心。供需缺口短期内难以逆转,这对存储行业投资者构成了明确信号。供应扩张面临结构性制约据摩根大通报告,美光指出存储市场供应紧张的成因具有结构性特征,并非单纯的产能周期问题。具体而言,供给增长受限主要来自两方面:一方面,新一代存储芯片的性能提升幅度正逐步收窄,意味着仅靠技术迭代来扩大有效供给的空间已明显压缩。另一方面,新一代HBM芯片的晶粒尺寸持续增大,导致单位晶圆产出的芯片数量下降,进一步削弱了供给弹性。此外,极紫外(EUV)光刻技术的引入虽有助于提升先进制程DRAM的制造精度,但同时也在产能爬坡速度与成本方面形成了新的约束。上述因素叠加之下,即便存储厂商积极扩产,短期内仍难以快速填补AI需求所催生的供给缺口。HBM4量产提速,1-gamma节点成历史最高产量节点在产品进展方面,美光披露了若干关键信息。美光管理层表示,受AI应用需求强劲拉动,公司1-gamma制程节点预计将成为其有史以来单位晶圆产出量最高的DRAM节点。HBM存储芯片通过将多层DRAM模块垂直堆叠封装而成,广泛应用于AI GPU,美光正持续将EUV光刻工艺整合至1-gamma节点的量产流程中。在HBM产品迭代节奏上,美光透露HBM4的量产爬坡速度是HBM3的两倍。下一代HBM4E产品的量产爬坡预计于2027年启动,首批样品将采用基于1-gamma节点生产的DRAM模块。AI推理需求扩张,带动SSD市场份额提升除HBM与DRAM外,美光还指出AI工作负载的演变正在为其固态硬盘(SSD)业务创造新的增长机遇。美光管理层表示,AI上下文窗口的持续扩大以及推理工作负载的快速增长,推动了对大容量、高性能存储的需求,公司借此在SSD市场实现了份额提升。值得注意的是,美光强调其策略并非提供标准化现货产品,而是与客户深度协作,针对具体应用场景定制开发存储解决方案,这一模式有助于巩固客户粘性并提升产品溢价空间。","news_type":1,"symbols_score_info":{"MU":1.98,"MULL":0.6,"MUD":0.6,"MUU":0.6}},"isVote":1,"tweetType":1,"viewCount":1744,"authorTweetTopStatus":1,"verified":2,"comments":[],"imageCount":0,"langContent":"EN","totalScore":0},{"id":565525500322568,"gmtCreate":1779100858459,"gmtModify":1779102954496,"author":{"id":"3573446332679706","authorId":"3573446332679706","name":"V y","avatar":"https://community-static.tradeup.com/news/e9262203e5c721f64c6375096716462d","crmLevel":12,"crmLevelSwitch":0,"followedFlag":false,"idStr":"3573446332679706","authorIdStr":"3573446332679706"},"themes":[],"title":"","htmlText":"No Sense! Just help someone to get lower price to buy in ","listText":"No Sense! Just help someone to get lower price to buy in ","text":"No Sense! Just help someone to get lower price to buy in","images":[],"top":1,"highlighted":1,"essential":1,"paper":1,"likeSize":2,"commentSize":0,"repostSize":0,"link":"https://ttm.financial/post/565525500322568","repostId":"2636024760","repostType":2,"repost":{"id":"2636024760","kind":"highlight","pubTimestamp":1779099628,"share":"https://ttm.financial/m/news/2636024760?lang=en_US&edition=fundamental","pubTime":"2026-05-18 18:20","market":"fut","language":"en","title":"Salesforce reinstated with an Underperform at BofA amid structural reset","url":"https://stock-news.laohu8.com/highlight/detail?id=2636024760","media":"TIPRANKS","summary":"As previously reported, BofA analyst Tal Liani reinstated coverage of Salesforce (CRM) with an Underperform rating and $160 price target Salesforce...","content":"<div>\n<p>As previously reported, BofA analyst Tal Liani reinstated coverage of Salesforce (CRM) with an Underperform rating and $160 price target Salesforce...</p>\n\n<a href=\"https://www.tipranks.com/news/the-fly/salesforce-reinstated-with-an-underperform-at-bofa-amid-structural-reset-thefly-news?utm_source=itigerup.com&utm_medium=referral\">Source Link</a>\n\n</div>\n","source":"tipranks_highlight","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>Salesforce reinstated with an Underperform at BofA amid structural reset</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nSalesforce reinstated with an Underperform at BofA amid structural reset\n</h2>\n\n<h4 class=\"meta\">\n\n\n2026-05-18 18:20 GMT+8 <a href=https://www.tipranks.com/news/the-fly/salesforce-reinstated-with-an-underperform-at-bofa-amid-structural-reset-thefly-news?utm_source=itigerup.com&utm_medium=referral><strong>TIPRANKS</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>As previously reported, BofA analyst Tal Liani reinstated coverage of Salesforce (CRM) with an Underperform rating and $160 price target Salesforce...</p>\n\n<a href=\"https://www.tipranks.com/news/the-fly/salesforce-reinstated-with-an-underperform-at-bofa-amid-structural-reset-thefly-news?utm_source=itigerup.com&utm_medium=referral\">Source Link</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"","relate_stocks":{"BK4588":"碎股","BK4550":"红杉资本持仓","LU0211327993.USD":"TEMPLETON GLOBAL EQUITY INCOME \"A\" (USD) ACC","LU0642271901.SGD":"Janus Henderson Horizon Global Technology Leaders A2 SGD-H","BK4598":"佩洛西持仓","IE00BZ1G4Q59.USD":"LEGG MASON CLEARBRIDGE US EQUITY SUSTAINABILITY LEADER \"A\"(USD) INC (A)","LU0251142724.SGD":"Fidelity America A-SGD","LU0082616367.USD":"摩根大通美国科技A(dist)","LU1551013425.SGD":"Allianz Income and Growth Cl AMg2 DIS H2-SGD","CRMG":"2倍做多CRM ETF- Leverage Shares","LU2756315318.SGD":"ALLIANZ INCOME AND GROWTH \"AMG\" (SGDHDG) INC A","LU1803068979.SGD":"FTIF - Franklin Technology A (acc) SGD-H1","LU0353189680.USD":"富国美国全盘成长基金Cl A 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